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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11004806 B1

PDFFull Text
Date of Patent:
May. 11, 2021

Filed:

Apr. 23, 2020

Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device

Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Yuichi Yamamoto, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Sheridan Ross P.C.

Primary Examiner:

Stephen W Smoot

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01); H01L 27/146 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/52 (2013.01); H01L 23/02 (2013.01); H01L 23/053 (2013.01); H01L 23/291 (2013.01); H01L 23/3135 (2013.01); H01L 23/49816 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 2021/60 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15153 (2013.01);
Abstract

The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

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