The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Oct. 12, 2018
Applicant:
United States of America As Represented BY the Administrator of Nasa, Washington, DC (US);
Inventors:
David J. Spry, Medina, OH (US);
Philip G. Neudeck, Olmsted Township, OH (US);
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 23/544 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 23/5226 (2013.01); H01L 23/544 (2013.01); H01L 24/06 (2013.01); H01L 29/1608 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/06135 (2013.01); H01L 2924/3512 (2013.01);
Abstract
An integrated circuit chip includes a wide bandgap semiconductor substrate, a plurality of semiconductor electronic components disposed on the semiconductor substrate, an overlying insulating layer disposed on the plurality of semiconductor devices, and a crack barrier laterally displaced from all of the plurality of semiconductor components. The crack barrier is configured to prevent propagation of cracks in the overlying insulating layer. The crack barrier does not conductively connect to any of the plurality of semiconductor electronic components.