The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Aug. 24, 2018
Kyocera Corporation, Kyoto, JP;
Shigeyoshi Fukuzono, Kyoto, JP;
Yuuki Baba, Kyoto, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
An electronic component mounting substrate including: an insulating substrate for mounting an electronic component; a via conductor disposed in the insulating substrate in an thickness direction of the insulating substrate; and a via pad conductor disposed in the insulating substrate, connected to the via conductor, having a thickness gradually increasing from an outer edge portion toward an inside portion, and including a protruding portion protruding from the via conductor in a width direction of the via conductor.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile