The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Nov. 29, 2017
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Taiki Sugiyama, Kanagawa, JP;
Yuichi Ishida, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C08L 93/00 (2006.01); H01L 23/29 (2006.01); H04N 9/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); C08L 93/00 (2013.01); H01L 23/29 (2013.01); H01L 23/3738 (2013.01); H04N 9/3144 (2013.01);
Abstract
A composite material includes a base resin, a heat dissipation filler that is mixed into the base resin, hollow particles that are mixed into the base resin, hollow particles that are mixed into the base resin, and bubbles that are formed in the base resin.
Quick Actions:
Sugiyama, Taiki. (2021). Composite material, electronic apparatus, and method for manufacturing electronic apparatus (U.S. Patent No. 11004767). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11004767
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile