The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
May. 15, 2019
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Hiroshi Somada, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01); H01L 23/29 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 23/12 (2013.01); H01L 23/293 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01);
Abstract
An electronic component includes a resin structure including first and second surfaces facing each other, an electronic component element contained in the resin structure, including first and second main surfaces facing each other, and side surfaces connecting the first and second main surfaces, and being exposed to the first surface of the resin structure, and a through-electrode penetrating the resin structure to connect the first and second surfaces of the resin structure, in which the through-electrode are in contact with at least one of the side surfaces of the electronic component element.