The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Apr. 16, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/049 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/053 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/049 (2013.01); H01L 23/053 (2013.01); H01L 23/142 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/49861 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H01L 29/7395 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A semiconductor device includes: a base plate; a semiconductor chip mounted on the base plate; a case surrounding the semiconductor chip on the base plate; an electrode terminal connected to the semiconductor chip; a sealing material covering an upper face of the base plate, the semiconductor chip and a part of the electrode terminal in the case; and a lid fastened to the case above the sealing material, wherein the electrode terminal is not exposed on an upper face of the sealing material, and there is a gap between the upper face of the sealing material and a lower face of the lid.