The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Jun. 20, 2019
Applicant:
Veeco Instruments Inc., Plainview, NY (US);
Inventors:
John Taddei, Jim Thorpe, PA (US);
David A. Goldberg, Plainview, NY (US);
Elena Lawrence, Media, PA (US);
Ian Cochran, Plainview, NY (US);
Christopher Orlando, Media, PA (US);
James Swallow, Plainview, NY (US);
Assignee:
VEECO INSTRUMENTS INC., Plainview, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01L 21/32134 (2013.01); H01L 21/67075 (2013.01); H01L 21/67253 (2013.01); H01L 24/03 (2013.01); H01L 2224/02313 (2013.01);
Abstract
A semiconductor etch process is provided in which an undercut is minimized during an etch process through tight control of etch profile, recognition of etch completion, and minimization of over etch time to increase productivity.