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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11004743 B1

PDFFull Text
Date of Patent:
May. 11, 2021

Filed:

Oct. 24, 2018

Dicing method and laser processing apparatus

Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Tsutomu Fujita, Yokkaichi Mie, JP;

Takanobu Ono, Kuwana Mie, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:

Kim & Stewart LLP

Primary Examiner:

Hung D Nguyen

Int. Cl.
CPC ...
B23K 26/08 (2014.01); B23K 26/00 (2014.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 21/268 (2006.01); H01L 21/67 (2006.01); B23K 26/03 (2006.01); B23K 26/364 (2014.01); B23K 26/04 (2014.01); B23K 26/53 (2014.01); B23K 26/14 (2014.01); H01L 21/683 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/04 (2013.01); B23K 26/08 (2013.01); B23K 26/0884 (2013.01); B23K 26/364 (2015.10); B23K 26/53 (2015.10); H01L 21/268 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 22/20 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); H01L 21/6836 (2013.01); H01L 2221/68327 (2013.01);
Abstract

According to one embodiment, a dicing method is provided. The dicing method includes detecting a first distance between a first portion of a substrate and a first substrate information detection unit. The method also includes detecting a second distance between a second portion of the substrate a second substrate information detection unit, the second portion different from the first portion. Distance information is calculated between the substrate and a processing lens, which is located farther from the second substrate information detection unit than from the first substrate information detection unit, based on the detected first distance and the detected second distance, and the substrate is irradiated with laser light from the processing lens based on the distance information.

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