The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
May. 15, 2019
Applicant:
Nikon Corporation, Tokyo, JP;
Inventors:
Hajime Mitsuishi, Yokohama, JP;
Isao Sugaya, Kawasaki, JP;
Minoru Fukuda, Tokyo, JP;
Masaki Tsunoda, Kamakura, JP;
Hidehiro Maeda, Yokohama, JP;
Ikuhiro Kuwano, Tokyo, JP;
Assignee:
NIKON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); B23K 20/00 (2006.01); H01L 21/50 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/185 (2013.01); B23K 20/002 (2013.01); H01L 21/02 (2013.01); H01L 21/50 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01); H01L 21/682 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01);
Abstract
A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.