The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Feb. 25, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/20 (2006.01); B32B 18/00 (2006.01); C04B 35/64 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); B32B 18/00 (2013.01); C04B 35/64 (2013.01); H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/20 (2013.01); C04B 2235/6562 (2013.01); C04B 2237/704 (2013.01); H01G 4/306 (2013.01);
Abstract
A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated. The green multilayer bodyis formed on the temporary holding filmformed on the release substrate. The green multilayer bodyis formed by repeating the first step forming a green functional part using the first ink containing the functional particles and the second step forming the green conductor part using the second ink containing the conductive particles. The temporary holding filmhas conductivity.