The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Jun. 26, 2018
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Keyvan Sayyah, Santa Monica, CA (US);

Oleg Efimov, Thousand Oaks, CA (US);

Pamela R. Patterson, Los Angeles, CA (US);

Raymond Sarkissian, Studio City, CA (US);

James H. Schaffner, Chatsworth, CA (US);

Biqin Huang, Torrance, CA (US);

David Hammon, Simi Valley, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/48 (2006.01); G01S 7/481 (2006.01); G01S 7/4911 (2020.01); G01S 17/58 (2006.01); G01S 17/42 (2006.01); G01S 17/34 (2020.01); G01S 17/86 (2020.01); G01S 17/931 (2020.01); G01S 7/499 (2006.01); G01S 17/02 (2020.01); G02B 6/122 (2006.01); G02B 6/27 (2006.01); G02B 6/42 (2006.01); H01L 23/544 (2006.01); H01L 31/0232 (2014.01); H01L 31/16 (2006.01); G01S 17/00 (2020.01); G01S 17/32 (2020.01); G01S 7/4914 (2020.01); G01S 7/491 (2020.01); G01S 7/497 (2006.01); B81B 7/02 (2006.01); G02B 27/30 (2006.01); H01S 5/125 (2006.01); G01S 7/4913 (2020.01); G02B 6/00 (2006.01);
U.S. Cl.
CPC ...
G01S 7/4815 (2013.01); B81B 7/02 (2013.01); G01S 7/4816 (2013.01); G01S 7/4817 (2013.01); G01S 7/4818 (2013.01); G01S 7/491 (2013.01); G01S 7/499 (2013.01); G01S 7/4911 (2013.01); G01S 7/4913 (2013.01); G01S 7/4914 (2013.01); G01S 7/4972 (2013.01); G01S 17/003 (2013.01); G01S 17/02 (2013.01); G01S 17/32 (2013.01); G01S 17/34 (2020.01); G01S 17/42 (2013.01); G01S 17/58 (2013.01); G01S 17/86 (2020.01); G01S 17/931 (2020.01); G02B 6/122 (2013.01); G02B 6/2766 (2013.01); G02B 6/4209 (2013.01); G02B 27/30 (2013.01); H01L 23/544 (2013.01); H01L 31/02327 (2013.01); H01L 31/16 (2013.01); H01S 5/125 (2013.01); B81B 2207/03 (2013.01); G02B 2006/0098 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01);
Abstract

A LIDAR system, LIDAR chip and method of manufacturing a LIDAR chip. The LIDAR system includes a photonic chip configured to transmit a transmitted light beam and to receive a reflected light beam, a scanner for directing the transmitted light beam towards a direction in space and receiving the reflected light beam from the selected direction, and a fiber-based optical coupler. The photonic chip and the scanner are placed on a semiconductor integrated platform (SIP). The fiber-based optical coupler is placed on top of the photonic chip to optically couple to the photonic chip for directing the a transmitted light beam from the photonic chip to the scanner and for directing a reflected light beam from the scanner to the photonic chip.


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