The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Jul. 20, 2018
Applicant:

Nordson Corporation, Westlake, OH (US);

Inventors:

Martin Bugg, Aylesbury, GB;

Robert Deards, Aylesbury, GB;

Assignee:

Nordson Corporation, Westlake, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 19/04 (2006.01); G01N 3/06 (2006.01); H05K 13/00 (2006.01); G01L 5/00 (2006.01); G01R 31/28 (2006.01); G01N 3/08 (2006.01); G01N 3/24 (2006.01);
U.S. Cl.
CPC ...
G01N 19/04 (2013.01); G01L 5/0033 (2013.01); G01N 3/068 (2013.01); G01N 3/08 (2013.01); G01N 3/24 (2013.01); G01R 31/2886 (2013.01); H05K 13/00 (2013.01); G01N 2203/0286 (2013.01); G01N 2203/0296 (2013.01); G01N 2203/0635 (2013.01); G01N 2203/0641 (2013.01); G01N 2203/0676 (2013.01); G01R 31/2896 (2013.01);
Abstract

A bond test apparatus comprises a test tool assemblycomprising a test toolconfigured to contact a bond during a bond test, a flexurecoupled to the test tool assembly, and a sensor. The sensor is configured to provide a measurement of a displacement of a first end of the flexurerelative to a second end of the flexure on application of a force to the flexure, and a processor is configured to receive a displacement signal from the sensor and, based on the displacement signal and optionally a known stiffness of the flexure, to determine the force on the flexure. A cartridge for a bond test apparatus, a method of measuring a force in a bond test apparatus, and a method of measuring the closing force on the jaws of a bond test tool are also provided.


Find Patent Forward Citations

Bugg, Martin. (2021). Bond test apparatus and method (U.S. Patent No. 11002662). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11002662

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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