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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11002010 B1

PDFFull Text
Date of Patent:
May. 11, 2021

Filed:

Mar. 18, 2019

Methods for making high sound transmission class gypsum boards and gypsum boards made by the method

Applicant:

United States Gypsum Company, Chicago, IL (US);

Inventors:

Suman Sinha Ray, Chicago, IL (US);

Mark Antosh, Arlington Heights, IL (US);

Mark Hemphill, Hawthorn Woods, IL (US);

Yijun Sang, Oak Park, IL (US);

Assignee:

UNITED STATES GYPSUM COMPANY, Chicago, IL (US);

Attorneys:

Vorys, Sater Seymour and Pease LLP

Pradip Sahu

Philip T. Petti

Primary Examiner:

Jasper Saberi

Int. Cl.
CPC ...
E04C 2/04 (2006.01); B32B 7/12 (2006.01); B32B 13/04 (2006.01); B32B 37/24 (2006.01); E04B 2/72 (2006.01); E04B 2/00 (2006.01); E04B 1/84 (2006.01); E04B 1/86 (2006.01); G10K 11/168 (2006.01); E04B 1/82 (2006.01); B32B 13/08 (2006.01); B32B 13/12 (2006.01); E04B 1/74 (2006.01);
U.S. Cl.
CPC ...
E04C 2/043 (2013.01); B32B 7/12 (2013.01); B32B 13/04 (2013.01); B32B 37/24 (2013.01); E04B 1/8409 (2013.01); E04B 2/723 (2013.01); E04C 2/46 (2013.01); B32B 13/08 (2013.01); B32B 13/12 (2013.01); B32B 2037/243 (2013.01); B32B 2255/26 (2013.01); B32B 2307/10 (2013.01); B32B 2307/102 (2013.01); B32B 2419/00 (2013.01); B32B 2607/00 (2013.01); E04B 1/74 (2013.01); E04B 1/82 (2013.01); E04B 1/86 (2013.01); E04B 2001/8263 (2013.01); G10K 11/168 (2013.01);
Abstract

A layered gypsum wallboard can include: a gypsum board having opposing front and back faces, wherein the gypsum board comprises a first cover sheet material at the front face, a second cover sheet material at the back face, and a gypsum core layer comprising gypsum; an adhesive layer on the second cover sheet material of the gypsum board, the adhesive including a polymer having a glass transition temperature (T) of −10° C. to 30° C.; an intermediate gypsum layer including gypsum on the adhesive layer such that the adhesive layer is between the second cover sheet material and the intermediate gypsum layer, wherein the adhesive layer and the intermediate gypsum layer have a combined thickness of 0.09 inches to 0.25 inches; and a third cover sheet material, wherein the intermediate gypsum layer is between and in contact with the adhesive layer and the third cover sheet material.

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