The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Sep. 04, 2018
Shenzhen Danbond Technology Co., Ltd, Guangdong, CN;
Ping Liu, Guangdong, CN;
SHENZHEN DANBOND TECHNOLOGY CO., LTD, Shenzhen, CN;
Abstract
A preparation method comprises the following steps: S1, laminating a plurality of thermoplastic polyimide films; S2, performing heat treatment while pressing the laminated thermoplastic polyimide films for bonding, wherein the temperature of heat treatment is lower than the temperature at which the thermoplastic polyimide films begin thermal decomposition, so that bonding occurs between the thermoplastic polyimide films to form a composite film; S3, heating the obtained composite film to a temperature above the temperature at which thermal decomposition begins, and then performing heat treatment, thereby obtaining the carbonized composite thermoplastic polyimide film. By the adoption of the preparation method, the TPI films can be conveniently and effectively formed into a high-quality multi-layer carbonized composite film and a multi-layer graphite composite film, and the composite films have excellent thermal diffusivity and bending resistance, so that heat dissipation of electronic equipment, precision instruments and the like can be easily realized.