The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Jun. 14, 2017
Applicant:
Sciosense B.v., AE Eindhoven, NL;
Inventors:
Willem Frederik Adrianus Besling, Eindhoven, NL;
Casper Van Der Avoort, Waalre, NL;
Coenraad Cornelis Tak, Waalre, NL;
Remco Henricus Wilhelmus Pijnenburg, Hoogeloon, NL;
Olaf Wunnicke, Eindhoven, NL;
Hendrik Bouman, Nijmegen, NL;
Assignee:
Sciosense B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/0023 (2013.01); G01D 11/245 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2203/032 (2013.01); B81C 2203/0785 (2013.01);
Abstract
The sensor package comprises a carrier () including electric conductors (), an ASIC device () and a sensor element (), which is integrated in the ASIC device (). A dummy die or interposer () is arranged between the carrier () and the ASIC device (). The dummy die or interposer () is fastened to the carrier (), and the ASIC device () is fastened to the dummy die or interposer ().