The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Feb. 23, 2017
Toray Industries, Inc., Tokyo, JP;
Tetsuya Motohashi, Nagoya, JP;
Takafumi Hashimoto, Nagoya, JP;
Chiasa Sato, Nagoya, JP;
Ichiro Taketa, Iyo-gun, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A molded article of a fiber-reinforced resin contains at least a bundled aggregate [A] of discontinuous reinforcing fibers and a matrix resin [M], wherein the average layer thickness h in the molded article of the fiber-reinforced resin is 100 μm or less and the CV value of the average layer thickness h is 40% or less; and a compression molding method therefor. It is possible to reliably and greatly reduce the occurrence of stress concentration in the molded article and to thereby achieve higher mechanical properties and further reduce variation in the mechanical properties.