The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Aug. 16, 2019
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Tsuneo Takano, Toyohashi, JP;

Yuuji Kazehaya, Toyohashi, JP;

Mitsushi Nishimura, Toyohashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01); B60B 5/02 (2006.01); B29C 43/36 (2006.01); B29C 33/54 (2006.01); B29C 70/34 (2006.01); B29L 22/00 (2006.01); B29K 105/12 (2006.01); B29K 105/08 (2006.01); B29L 31/32 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); B29C 33/54 (2013.01); B29C 43/36 (2013.01); B29C 70/345 (2013.01); B60B 5/02 (2013.01); B29C 2043/3605 (2013.01); B29C 2043/3665 (2013.01); B29C 2043/3668 (2013.01); B29K 2105/089 (2013.01); B29K 2105/12 (2013.01); B29L 2022/00 (2013.01); B29L 2031/32 (2013.01); B60B 2310/204 (2013.01); B60B 2360/344 (2013.01); B60B 2360/346 (2013.01); B60B 2360/3412 (2013.01); B60B 2360/3414 (2013.01); B60B 2360/3416 (2013.01);
Abstract

The present invention applies to a molding method for a fiber-reinforced plastic structure having an internal cavity. Firstly, grain groups, which mainly consist of a plurality of high-rigidity grains, are accommodated in bags, and a plurality of cores are formed. A reinforcing fiber substrate, is placed between the plurality of adjacent cores so as to be interposed therebetween. For example, a plurality of molding base materials are prepared by surrounding each core with a prepreg, and the plurality of molding base materials are combined and placed inside a molding die, and the molding base materials are compression molded. When compression molding, a part of the outer surface of the cores is locally pressurized, and the internal pressure of the cores is increased, changing the shape thereof, thus eliminating voids that are present between the cores and the prepreg and/or the prepreg and the molding surface of the die.


Find Patent Forward Citations

Loading…