The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Sep. 14, 2017
Applicant:

Norton (Waterford) Limited, Waterford, IE;

Inventors:

Enrique Calderon Oliveras, Waterford, IE;

Daniel Buck, Waterford, IE;

Erica Jamie Kantor, Cambridge, GB;

Ross William Weir, Cambridge, GB;

James Roche, Enniscorthy, IE;

Steven David Gardner, Peterborough, GB;

Robert Owen Kivlin, Cambridge, GB;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61M 15/00 (2006.01); A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
A61M 15/0023 (2014.02); A61B 5/4833 (2013.01); A61M 15/0025 (2014.02); A61M 15/0065 (2013.01); A61M 15/0086 (2013.01); A61M 15/009 (2013.01); A61M 15/0021 (2014.02); A61M 15/0096 (2014.02); A61M 2202/064 (2013.01); A61M 2205/3569 (2013.01); A61M 2205/50 (2013.01); A61M 2205/502 (2013.01); A61M 2205/8206 (2013.01); A61M 2205/8212 (2013.01);
Abstract

The introduction of electronics into a drug delivery device may introduce certain technical challenges, such as durability, electro-mechanical integration, and drug delivery performance. The present disclosure provides solutions for inclusion of an electronics module with an inhaler. For example, heat stakes may be used to secure a printed circuit board (PCB) to an electronics module's housing. Also for example, a slider may be used to transfer vertical movement of an inhaler's yoke to an electronics module's switch. Also for example, certain seals may be used when interfacing the electronics module to other portions of the device's housing to achieve a desired performance.


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