The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Nov. 13, 2018
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Gye Won Lee, Suwon-si, KR;
Nam Gyun Yim, Suwon-si, KR;
Eun Bae Park, Suwon-si, KR;
Hong Seok Lee, Suwon-si, KR;
Jong Yun Kim, Suwon-si, KR;
Woo Sung Jung, Suwon-si, KR;
Mi Jung Kim, Suwon-si, KR;
Chang Ju Lee, Suwon-si, KR;
Hee Sun Oh, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.