The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Apr. 29, 2020
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Mikhail Pevzner, Woburn, MA (US);

Donald G. Hersey, Beverly, MA (US);

Gregory G. Beninati, Salem, NH (US);

Thomas J. Tellinghuisen, Pelham, NH (US);

James E. Benedict, Chelmsford, MA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H05K 1/144 (2013.01); H05K 2201/09845 (2013.01);
Abstract

Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.


Find Patent Forward Citations

Loading…