The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Sep. 06, 2019
Applicant:

Lumileds Holding B.v., Schiphol, NL;

Inventors:

Matthias Epmeier, Aachen, DE;

Petra Wellmeier, Aachen, DE;

Frank Giese, Aachen, DE;

Carsten Weber, Jülich, DE;

Michael Deckers, Jülich, DE;

Georg Henninger, Aachen, DE;

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1225 (2013.01); H05K 3/321 (2013.01); H05K 3/341 (2013.01); H05K 3/3478 (2013.01);
Abstract

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.


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