The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Jun. 13, 2018
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Chan-Gi Park, Gyeonggi-do, KR;
Yikyu Min, Gyeonggi-do, KR;
Han Min Cho, Gyeonggi-do, KR;
Yeonsang Yun, Gyeonggi-do, KR;
Tae-Wook Ham, Gyeonggi-do, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 5/00 (2006.01); H01Q 1/22 (2006.01); H01P 3/08 (2006.01); H01Q 21/28 (2006.01); H01Q 1/24 (2006.01); H01P 3/00 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H01P 3/003 (2013.01); H01P 3/08 (2013.01); H01P 3/081 (2013.01); H01P 3/085 (2013.01); H01Q 1/22 (2013.01); H01Q 1/243 (2013.01); H01Q 9/0421 (2013.01); H01Q 21/28 (2013.01); H05K 1/025 (2013.01); H05K 5/0017 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/10098 (2013.01);
Abstract
A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.