The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Jan. 17, 2020
Applicant:
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Inventors:
Assignee:
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 17/02 (2006.01); H04R 1/04 (2006.01); H04R 31/00 (2006.01); H04R 7/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0077 (2013.01); B81C 1/00333 (2013.01); H04R 1/04 (2013.01); H04R 7/04 (2013.01); H04R 17/02 (2013.01); H04R 19/005 (2013.01); H04R 31/003 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0172 (2013.01); H04R 2201/003 (2013.01);
Abstract
A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.