The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Oct. 23, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yuusuke Shimizu, Kyoto, JP;

Kazutoshi Onozawa, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H04N 5/369 (2011.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 27/146 (2006.01); H04N 5/3745 (2011.01);
U.S. Cl.
CPC ...
H04N 5/379 (2018.08); H01L 23/49816 (2013.01); H01L 25/0657 (2013.01); H01L 27/14609 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 5/37455 (2013.01);
Abstract

A solid-state image capture device includes a first semiconductor substrate and a second semiconductor substrate. The first semiconductor substrate includes a first connection and a pixel array in which a plurality of pixels are arranged in a matrix. The second semiconductor substrate includes a second connection and a pad area including a plurality of pad electrodes for electrical connection with external equipment. The second semiconductor substrate controls the pixel array. The first and second semiconductor substrates are stacked and joined together, with the first and second connections electrically connected to each other. The first and second semiconductor substrates are substantially equal in size, and the pad electrodes are included in only the second semiconductor substrate.


Find Patent Forward Citations

Loading…