The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Apr. 09, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kazuhiro Kawahara, Tokyo, JP;

Koichiro Noguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/60 (2006.01); H02K 11/33 (2016.01); H01L 23/31 (2006.01); H02P 27/08 (2006.01); H01L 23/495 (2006.01); H02K 11/35 (2016.01); H03K 19/0185 (2006.01); H03K 19/018 (2006.01);
U.S. Cl.
CPC ...
H03K 17/602 (2013.01); H01L 23/3107 (2013.01); H01L 23/49575 (2013.01); H02K 11/33 (2016.01); H02K 11/35 (2016.01); H02P 27/085 (2013.01); H03K 19/018 (2013.01); H03K 19/018507 (2013.01);
Abstract

A semiconductor module includes: a control circuit for controlling first and second transistors operating complementarily; and an internal controller receiving a data signal including a set value of an operating characteristic from an external controller to store the data signal in a memory and then transferring the set value of the operating characteristic to the control circuit. The data signal is sent to the internal controller in the order of the set value of the operating characteristic and a specific trigger value. The internal controller transfers the set value of the operating characteristic to the control circuit in timed relation to writing of the specific trigger value into the memory. The control circuit includes first and second drivers. The control circuit changes settings of the first and second drivers to thereby change the operating characteristic of the semiconductor module.


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