The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Sep. 17, 2019
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Tomoya Sato, Shizuoka, JP;
Hiroshi Aoki, Shizuoka, JP;
Naoki Ito, Shizuoka, JP;
Yasunori Nabeta, Shizuoka, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 1/14 (2006.01); B23K 20/10 (2006.01); H02G 15/08 (2006.01);
U.S. Cl.
CPC ...
H02G 1/14 (2013.01); B23K 20/10 (2013.01); H02G 15/08 (2013.01);
Abstract
A wire bonding method includes: arranging a first core including a plurality of strands exposed from an insulating sheath of a first wire, onto a side of an anvil and a second core including a plurality of strands exposed from an insulating sheath of a second wire, onto a side of a horn for ultrasonic bonding, the second core being larger in sectional area than the first core; and bonding the first core and the second core together by ultrasonic bonding between the horn and the anvil.