The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Jan. 14, 2019
Applicant:

Nxp B.v., Eindhoven, NL;

Assignee:

NXP B.V., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/02 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); H01L 27/222 (2013.01);
Abstract

Embodiments are provided for a packaged semiconductor device including: a semiconductor die having an active side and an opposite back side, the semiconductor die including a magnetoresistive random access memory (MRAM) cell array formed within an MRAM area on the active side of the semiconductor die; and a top cover including a soft-magnetic material positioned on the back side of the semiconductor die, wherein the top cover includes a recess formed in a first major surface of the top cover, the first major surface faces the back side of the semiconductor die, and the recess is positioned over the MRAM cell array.


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