The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Aug. 13, 2019
SK Hynix Inc., Icheon-si, KR;
Min Kyu Kang, Seoul, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package includes a plurality of stacked first semiconductor chips disposed over a substrate. At least a portion of the plurality of stacked first semiconductor chips is encapsulated in a first mold layer. The semiconductor package also includes a plurality of stacked second semiconductor chips disposed over the topmost chip of the stacked first semiconductor chips and the first mold layer. The semiconductor package also includes a third semiconductor chip disposed over the first mold layer and adjacent to the stacked second semiconductor chips. At least a portion of the third semiconductor chip overlaps with a portion of one or more of the stacked second semiconductor chips.