The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Feb. 08, 2018
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Daniel Brodoceanu, Saarbrucken, DE;

Allan Pourchet, Cork, IE;

Oscar Torrents Abad, Saarbrucken, DE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/40 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 24/05 (2013.01); H01L 25/0753 (2013.01); H01L 33/30 (2013.01); H01L 33/405 (2013.01); H01L 33/62 (2013.01); H01L 33/32 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/80121 (2013.01); H01L 2224/80224 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10331 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A laser is used to induce bonding of LED contact pads with corresponding substrate contact pads on a display substrate. The wavelength of the laser light and the material used for the contact pads are both selected so that the laser light is capable of melting the contact pads. For example, the laser light has a wavelength of between 220 nm and 1200 nm, and the contact pads are formed of a copper-tin oxide (CuSn). Furthermore, the system may be configured to shine the laser light through a number of other components, such as the pick-up head and the LED itself. These materials can be formed of materials that do not absorb the energy of the laser light. Bonding the contacts with a laser in this manner allows for faster heating and cooling times, avoids reheating of previously bonded contact pads, and reduces thermal expansion of the display substrate.


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