The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Aug. 27, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Dmitri Alex Tschumakow, Dresden, DE;
Claus Dahl, Dresden, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01P 7/06 (2006.01); H01P 11/00 (2006.01); G01J 3/28 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/3205 (2006.01); G01N 22/00 (2006.01); H01Q 13/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01P 7/065 (2013.01); H01P 11/008 (2013.01); G01J 3/2803 (2013.01); G01N 22/00 (2013.01); H01L 21/308 (2013.01); H01L 21/31144 (2013.01); H01L 21/32051 (2013.01); H01L 21/32139 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01Q 13/10 (2013.01);
Abstract
A semiconductor chip may include high frequency electrical circuitry. The semiconductor chip may include a cavity resonator integrated with the high frequency electrical circuitry in a semiconductor substrate of the semiconductor chip. The cavity resonator may include a resonator body in a cavity in the semiconductor substrate of the semiconductor chip. The resonator body may comprise a metal layer. The cavity resonator may include a feeding structure electrically connected to the high frequency electrical circuitry.