The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Oct. 11, 2018
Hrl Laboratories, Llc, Malibu, CA (US);
Florian G. Herrault, Malibu, CA (US);
David Brown, Malibu, CA (US);
Hasan Sharifi, Malibu, CA (US);
Joel C. Wong, Malibu, CA (US);
Dean C. Regan, Malibu, CA (US);
Yan Tang, Malibu, CA (US);
Helen Fung, Malibu, CA (US);
HRL Laboratories, LLC, Malibu, CA (US);
Abstract
An electronic assembly, comprising a carrier wafer having a top wafer surface and a bottom wafer surface; an electronic integrated circuit being formed in the carrier wafer and comprising a wafer contact pad on the top wafer surface; said carrier wafer comprising a through-wafer cavity joining the top and bottom wafer surfaces; a component chip having a component chip top surface, a component chip bottom surface and component chip side surfaces, the component chip being held in said through-wafer cavity by direct contact of at least a side surface of said first component chip with an attachment metal that fills at least a portion of said through-wafer cavity; said component chip comprising at least one component contact pad on said component chip top surface; a first conductor connecting said wafer contact pad and said component contact pad.