The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Dec. 14, 2018
SK Hynix Inc., Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor device includes a semiconductor chip body having a surface on which a chip pad is disposed, a passivation layer covering the surface of the semiconductor chip body and providing a tapered hole revealing the chip pad, and a redistributed layer (RDL) structure disposed on the passivation layer. The RDL structure includes a first RDL interconnection portion spaced apart from the tapered hole and passing by the tapered hole and a second RDL overlapping pad portion configured to have a bottom portion contacting the revealed chip pad and configured to have a first side surface facing a side surface of the first RDL interconnection portion. A central portion of the first side surface of the second RDL overlapping pad portion extends toward the side surface of the first RDL interconnection portion such that the first side surface is curved.