The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Apr. 02, 2018
Shenzhen Refond Optoelectronics Co., Ltd., Shenzhen, CN;
Zhi You, Shenzhen, CN;
Xiaoming Pei, Shenzhen, CN;
Shenzhen Refond Optoelectronics Co., Ltd., Shenzhen, CN;
Abstract
Provided is a semiconductor encapsulation structure, including: a device base () and a cover plate (). The device base is provided with a cavity () for accommodating a chip (). The device base is further provided with a cover-plate sintered layer (). The cover-plate sintered layer is metallized. The cover plate matches the device base. The cover plate is provided with a base sintered layer (). The base sintered layer is also metallized. The cover plate is connected to the base by sintering. The cover plate is connected to the base by sintering, so that low-temperature connection is achieved, thereby avoiding damage to the chip and electronic components in the base caused by high connection temperature. Furthermore, encapsulating costs are greatly reduced while ensuring connection reliability.