The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Jul. 13, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yasuo Ohashi, Hadano, JP;

Kazuyuki Ueda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 35/12 (2006.01); H05G 1/02 (2006.01); H01J 35/02 (2006.01); H01J 35/32 (2006.01); H01J 35/16 (2006.01); H01J 35/08 (2006.01); H01J 35/18 (2006.01); H01J 1/94 (2006.01); H01J 37/02 (2006.01); G01N 23/04 (2018.01);
U.S. Cl.
CPC ...
H01J 35/186 (2019.05); G01N 23/04 (2013.01); H01J 35/02 (2013.01); H01J 35/08 (2013.01); H01J 35/12 (2013.01); H01J 35/165 (2013.01); H01J 35/32 (2013.01); H05G 1/025 (2013.01); G01N 2223/308 (2013.01); H01J 1/94 (2013.01); H01J 35/116 (2019.05); H01J 37/023 (2013.01); H01J 2235/08 (2013.01); H01J 2235/083 (2013.01); H01J 2235/085 (2013.01); H01J 2235/086 (2013.01); H01J 2237/032 (2013.01); H01J 2237/036 (2013.01); H05G 1/02 (2013.01);
Abstract

A thickness of a bonding material () is varied in a radial direction orthogonal to a central axis (P) of the tubular anode member (), the bonding material () being used for bonding a transmitting substrate () for supporting a target layer () and a tubular anode member () in a direction along the central axis (P). Thus, a region in which a circumferential tensile stress of the bonding material () is alleviated is formed in the direction along the central axis (P) to prevent a crack from developing in the bonding material ().


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