The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Aug. 29, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Hitoshi Ohkubo, Tokyo, JP;
Masazumi Arata, Tokyo, JP;
Manabu Ohta, Tokyo, JP;
Shou Kawadahara, Tokyo, JP;
Yoshihiro Maeda, Tokyo, JP;
Takahiro Kawahara, Tokyo, JP;
Hokuto Eda, Toyko, JP;
Shigeki Sato, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 41/043 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01); H01F 2017/0066 (2013.01);
Abstract
In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.