The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Jun. 05, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Tomonaga Nishikawa, Tokyo, JP;

Tomokazu Ito, Tokyo, JP;

Manabu Yamatani, Tokyo, JP;

Masanori Suzuki, Tokyo, JP;

Ikuya Kokubo, Tokyo, JP;

Takuya Takeuchi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/04 (2006.01); H01F 27/29 (2006.01); H01F 5/06 (2006.01); H01F 41/12 (2006.01); H01F 17/04 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 5/04 (2013.01); H01F 5/06 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 41/12 (2013.01); H01F 2017/048 (2013.01);
Abstract

Disclosed herein is a coil component that includes: a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, the coil part having a mounting surface substantially parallel to the lamination direction and an upper surface substantially parallel to the lamination direction and positioned on an opposite side to the mounting surface; and a direction mark comprising a conductive material that covers a part of the conductor layers exposed on the upper surface.


Find Patent Forward Citations

Loading…