The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Nov. 29, 2016
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Automotive Systems Inc., Shiga, JP;

Inventors:

Yoshikazu Okuno, Tokyo, JP;

Yoshiaki Kobayashi, Tokyo, JP;

Tatsuya Nakatsugawa, Tokyo, JP;

Kengo Mitose, Tokyo, JP;

Akira Tachibana, Tokyo, JP;

Shingo Kawata, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C25D 5/12 (2006.01); H01H 1/025 (2006.01); B21D 53/00 (2006.01); H01H 1/04 (2006.01); C25D 5/50 (2006.01); B32B 15/01 (2006.01); C22F 1/10 (2006.01); C25D 5/34 (2006.01); C25D 7/00 (2006.01); C22F 1/08 (2006.01); C22F 1/16 (2006.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); B21D 53/00 (2013.01); B32B 15/01 (2013.01); B32B 15/018 (2013.01); C22F 1/08 (2013.01); C22F 1/10 (2013.01); C22F 1/16 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 5/505 (2013.01); C25D 7/00 (2013.01); H01H 1/025 (2013.01); H01H 1/04 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 5/34 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12715 (2015.01);
Abstract

An electrical contact material () having: a conductive substrate () formed from copper or a copper alloy; a first intermediate layer () provided on the conductive substrate (); a second intermediate layer () provided on the first intermediate layer (); and an outermost layer () formed from tin or a tin alloy and provided on the second intermediate layer (), wherein the first intermediate layer () is constructed as one layer of grains extending from the conductive substrate () side to the second intermediate layer () side, and wherein, in the first intermediate layer (), the density of grain boundaries () extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μmor less; a method of producing the same; and a terminal.


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