The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Mar. 30, 2018
Applicant:

Siemens Industry Software Inc., Plano, TX (US);

Inventors:

Prakhar Jaiswal, Buffalo, NY (US);

Suraj Ravi Musuvathy, Princeton, NJ (US);

Erhan Arisoy, Princeton, NJ (US);

David Madeley, Louth, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 19/20 (2011.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); G05B 13/02 (2006.01); G05B 19/4099 (2006.01); G06T 5/00 (2006.01); G06T 5/30 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
G06T 19/20 (2013.01); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); G05B 13/0265 (2013.01); G05B 19/4099 (2013.01); G06T 5/002 (2013.01); G06T 5/30 (2013.01); G05B 2219/35134 (2013.01); G05B 2219/49008 (2013.01); G06T 2207/20081 (2013.01); G06T 2219/2016 (2013.01); G06T 2219/2021 (2013.01);
Abstract

Systems and methods may support identification and redesign of critical thin segments in a 3D model that are below 3D printer resolution. Identification of critical thin segments may include segmenting cross-sectional slices of the 3D model into printable segments and non-printable segments and using a machine learning model trained using geometrical features computed on thin regions to classify the non-printable segments as critical or non-critical. Redesign of critical thin segments may include thickening the critical thin segments such that the segment size of the critical thin segments satisfy a thickening criterion with respect to the printer resolution and smoothing sharp corners added to the cross-sectional slice at an intersection between the critical thin segment and a neighboring printable segment. Redesign of the critical thin segments may account for tolerable overhang.


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