The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Feb. 13, 2019
The Boeing Company, Chicago, IL (US);
Brian P. Justusson, Saint Peters, MO (US);
Joseph D. Schaefer, Richmond Heights, MO (US);
Matthew Jeffrey Molitor, O'Fallon, MO (US);
THE BOEING COMPANY, Chicago, IL (US);
Abstract
A method includes obtaining failure initiation characteristics of a bonding layer of one or more bonded structures and determining, based on the failure initiation characteristics, a first characteristic dimension for each analysis element of a first portion of a finite element analysis model. The method includes obtaining failure propagation characteristics of the bonding layer and determining, based on the failure propagation characteristics, a second characteristic dimension for each analysis element of a second portion of the model. The method includes assigning a first set of material parameters to analysis elements of the first portion of the model and assigning a second set of material parameters to analysis elements of the second portion of the model. The method includes evaluating failure modes of the one or more bonded structures based on a solution to the model, the first set of material parameters, and the second set of material parameters.