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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10996198 B1

PDFFull Text
Date of Patent:
May. 04, 2021

Filed:

Jun. 10, 2016

Integrated circuit sensor and sensor substrate

Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Kunihiko Iizuka, Sakai, JP;

Akira Saito, Sakai, JP;

Takeshi Mitsunaka, Sakai, JP;

Nobuyuki Ashida, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, JP;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Huy Q Phan

Assistant Examiner:

Adam S Clarke

Int. Cl.
CPC ...
G01N 27/72 (2006.01); H03B 5/12 (2006.01); H01L 23/31 (2006.01); G01N 27/22 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/72 (2013.01); G01N 27/22 (2013.01); H01L 23/3121 (2013.01); H01L 23/3185 (2013.01); H01L 23/481 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H03B 5/1212 (2013.01); H03B 5/1228 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An integrated circuit sensor that enables, regardless of a type of an inspection object, the inspection object and a front surface of the integrated circuit sensor to be in reliable contact with each other in a large region is provided. A through silicon via () that electrically connects an inside of an integrated circuit sensor () and an outside of the integrated circuit sensor () is formed in the inside of the integrated circuit sensor () so as to reach a rear surface of the integrated circuit sensor (), which faces the front surface of the integrated circuit sensor ().

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