The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Mar. 06, 2019
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Samsung Sdi Co., Ltd., Yongin-si, KR;

Inventors:

Sooghang Ihn, Hwaseong-si, KR;

Dalho Huh, Suwon-si, KR;

Namheon Lee, Suwon-si, KR;

Jhunmo Son, Yongin-si, KR;

Hosuk Kang, Suwon-si, KR;

Sangmo Kim, Hwaseong-si, KR;

Jongsoo Kim, Suwon-si, KR;

Joonghyuk Kim, Seoul, KR;

Hyunjung Kim, Suwon-si, KR;

Youngmok Son, Hwaseong-si, KR;

Myungsun Sim, Suwon-si, KR;

Yeonsook Chung, Seoul, KR;

Youngseok Park, Yongin-si, KR;

Yongsik Jung, Yongin-si, KR;

Assignees:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do, KR;

SAMSUNG SDI CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/50 (2006.01); C09K 11/06 (2006.01); C09K 11/02 (2006.01); H05B 33/14 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
C09K 11/06 (2013.01); C09K 11/02 (2013.01); H05B 33/14 (2013.01); C09K 2211/1007 (2013.01); C09K 2211/1011 (2013.01); C09K 2211/1029 (2013.01); C09K 2211/1033 (2013.01); C09K 2211/1037 (2013.01); C09K 2211/1044 (2013.01); C09K 2211/1059 (2013.01); C09K 2211/1092 (2013.01); C09K 2211/185 (2013.01); H01L 51/0059 (2013.01); H01L 51/0067 (2013.01); H01L 51/0071 (2013.01); H01L 51/0072 (2013.01); H01L 51/0085 (2013.01); H01L 51/5016 (2013.01); H01L 2251/5384 (2013.01);
Abstract

A thin film including a combination of a donor compound and an acceptor compound, and a phosphorescent dopant, wherein the donor compound and the acceptor compound form an exciplex having characteristics described in the specification.


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