The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Nov. 30, 2018
Applicant:

Microcosm Technology Co., Ltd, Tainan, TW;

Inventor:

Tang-Chieh Huang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/30 (2018.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/30 (2018.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01);
Abstract

The present invention relates to an adhesive composition, which comprises an epoxy resin; and a polyimide comprising a repeating unit. The repeating unit comprises a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2): wherein X, Y, Z, m, and n are as defined herein, the weight ratio of polyimide to the total amount of the epoxy resin is 50% to 100%, and in the epoxy resin, the proportion of the epoxy resin having a weight average molecular weight of less than 400 Da accounts for 12 to 40% by weight of the total amount of the epoxy resin. The adhesive formed by the adhesive composition of the present invention has a relatively high glass transition temperature.


Find Patent Forward Citations

Huang, Tang-Chieh. (2021). Adhesive composition, adhesive comprising the same, and cured product thereof (U.S. Patent No. 10995243). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10995243

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