The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Jan. 16, 2018
Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Ryuta Mizuochi, Toyama, JP;

Yasunobu Someya, Toyama, JP;

Hiroyuki Wakayama, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/00 (2006.01); H01L 21/027 (2006.01); C08F 293/00 (2006.01); B05D 3/00 (2006.01); C08F 299/02 (2006.01);
U.S. Cl.
CPC ...
C08F 293/005 (2013.01); B05D 3/007 (2013.01); B05D 5/00 (2013.01); C08F 299/022 (2013.01); H01L 21/027 (2013.01); B05D 2350/60 (2013.01); B05D 2518/10 (2013.01);
Abstract

A self-assembled film-forming composition for orthogonally inducing, with respect to a substrate, a microphase separation structure in a layer including a block copolymer, in the whole surface of a coating film, even at high heating temperatures at which arrangement failure of the microphase separation of the block copolymer occurs. The self-assembled film-forming composition includes a block copolymer, and at least two solvents having different boiling points as a solvent. The block copolymer is obtained by bonding: a non-silicon-containing polymer having, as a structural unit, styrene, a derivative thereof, or a structure derived from a lactide; and a silicon-containing polymer having, as a structural unit, styrene substituted with silicon-containing groups. The solvent includes: a low boiling point solvent (A) having a boiling point of 160° C. or lower; and a high boiling point solvent (B) having a boiling point of 170° C. or higher.


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