The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Dec. 20, 2019
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Daniel Gene Dunn, Guilderland, NY (US);

Henry Charles McGuigan, Duanesburg, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/80 (2006.01); C04B 35/565 (2006.01); C04B 35/653 (2006.01); C04B 35/628 (2006.01);
U.S. Cl.
CPC ...
C04B 35/806 (2013.01); C04B 35/565 (2013.01); C04B 35/62849 (2013.01); C04B 35/62852 (2013.01); C04B 35/62878 (2013.01); C04B 35/62894 (2013.01); C04B 35/653 (2013.01); C04B 2235/616 (2013.01); F05D 2300/6033 (2013.01);
Abstract

Methods for preparing ceramic matrix composites using melt infiltration are provided as well as the resulting ceramic matrix composites. The methods and products include the incorporation of a non-wetting coating to one or more sacrificial fibers. The one or more sacrificial fibers are removed, such as decomposed during pyrolysis, resulting in the formation of a plurality of functional features, in the form of regular and elongate channels along the ceramic matrix composite. During the removing of the one or more sacrificial fibers, the non-wetting coating remains on an interior surface of the plurality of functional features to block infiltration of an infiltrant to the plurality of functional features and deposition thereon. Alternatively, the sacrificial fibers may be removed subsequent to melt infiltration.


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