The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Dec. 15, 2017
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Vijaye Rajaraman, Reutlingen, DE;
Eckart Schellkes, Taipei, TW;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01L 9/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00285 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81C 2203/0145 (2013.01); B81C 2203/031 (2013.01);
Abstract
A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.