The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Feb. 24, 2016
Applicant:
Mitsubishi Electric Research Laboratories, Inc., Cambridge, MA (US);
Inventors:
William S Yerazunis, Acton, MA (US);
William T Vetterling, Lexington, MA (US);
Assignee:
Mitsubishi Electric Research Laboratories, Inc., Cambridge, MA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/346 (2014.01); B23K 26/14 (2014.01); B23K 26/342 (2014.01); B23K 26/08 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B23K 26/346 (2015.10); B23K 26/083 (2013.01); B23K 26/1423 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract
A system and method depositing metal to form a three-dimensional (3D) part on a substrate. A wire is moved relative to a location on the substrate while a laser heats a proximal end of the wire at the location using a laser beam. The laser causes the wire and substrate to reach a melting point of the wire to fuse the wire at the location on the substrate. The wire can be preheated by passing a current through the wire.