The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Nov. 08, 2019
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventor:

Tsuyoshi Saito, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B22F 3/10 (2006.01); B22F 3/105 (2006.01); B22F 3/24 (2006.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/1028 (2013.01); B22F 3/1055 (2013.01); B22F 3/24 (2013.01); B22F 2003/1057 (2013.01); B22F 2003/248 (2013.01); B33Y 30/00 (2014.12);
Abstract

A lamination molding apparatus includes an irradiator, a processing unit, and a cooling device. The irradiator irradiates a material layer with a beam to form a solidified layer. The processing unit includes a processing head having a tool that performs processing on the solidified layer, and a processing head driver moving the processing head at least in a horizontal direction. The cooling device is provided in the processing head and cools at least a part of a solidified body including an upper surface to a predetermined cooling temperature, and the solidified body is formed by laminating the solidified layer. The cooling device includes a cooling plate having a cooling surface being cooled to the cooling temperature, and the cooling surface is in close contact with the upper surface of the solidified body in a recumbent state with the cooling surface along the horizontal direction.


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