The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Jun. 24, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kuniaki Yosui, Nagaokakyo, JP;

Daisuke Tonaru, Nagaokakyo, JP;

Hideyuki Taguchi, Nagaokakyo, JP;

Genro Kato, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/28 (2013.01); H05K 1/0296 (2013.01); H05K 1/03 (2013.01); H05K 1/111 (2013.01); H05K 1/14 (2013.01); H05K 3/3494 (2013.01); H05K 3/363 (2013.01); H05K 1/028 (2013.01); H05K 1/118 (2013.01); H05K 1/147 (2013.01); H05K 1/18 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/057 (2013.01);
Abstract

A first board includes a first insulating substrate including a first main surface, a first electrode pad, and a first resist film. The first electrode pad is a conductor pattern provided on the first main surface. The first resist film is provided on the first main surface and is located closer to the first electrode pad than any conductor provided on the first main surface. The first resist film is spaced away from the first electrode pad with a gap provided between the first resist film and the first electrode pad. The first resist film is thicker than the first electrode pad.


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