The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Sep. 27, 2019
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Chih-Chieh Fu, New Taipei, TW;
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A module-embedded multilayer circuit board includes an inner circuit board, component embedded module embedded in the through opening, a first outer circuit board, and a second outer circuit board. A through opening is defined in the inner circuit board. The component embedded module includes a top surface and side surfaces. The top surface has a length greater than that of the two side surfaces. Each component embedded module includes a component, upper circuit patterns formed on the top surface, and side circuit patterns formed on the side surface and exposed from the through opening. The first and the second outer circuit board are formed on the inner circuit board. One end of the side circuit patterns is electrically connected to the first and the second outer circuit board, the other end of the side circuit patterns is electrically connected to the component by the upper circuit patterns, respectively.