The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Jun. 25, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles Leon Arvin, Poughkeepsie, NY (US);

Mark K. Hoffmeyer, Rochester, MN (US);

Kevin Drummond, Hopewell Junction, NY (US);

Chris Muzzy, Burlington, VT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01R 13/11 (2006.01); H01R 12/52 (2011.01); H01R 12/71 (2011.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/145 (2013.01); H01R 12/52 (2013.01); H01R 12/716 (2013.01); H01R 13/11 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10325 (2013.01);
Abstract

A modified socket mechanism comprises a printed circuit board and a connector component located on a first face of the printed circuit board. The modified socket mechanism may comprise a first region of electrical contacts located on the first face. The first region of electrical contacts may be designed to interface with a processor module. The modified socket mechanism may also comprise a second region of electrical contacts located on a second face of the printed circuit board. The second region of electrical contacts may be designed to interface with a motherboard. The modified socket mechanism may also comprise a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board. Finally, the modified socket mechanism may also comprise a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board.


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